Inventor

WONG KWONG HON

US57 patents

⚠️ This page may combine multiple inventors who share the name “WONG KWONG HON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WONG KWONG HON

IBM

Semiconductor chip using both polysilicon and metal gate devices

Method of making electroplated interconnection structures on integrated circuit chips

High-temperature stable gate structure with metallic electrode

Three-dimensional island pixel photo-sensor

Highly conformal titanium nitride deposition process for high aspect ratio structures

Vertical paddle plating cell

Three-dimensional island pixel photo-sensor

Method to fabricate passive components using conductive polymer

Metal spacer gate for CMOS FET

Integrated metal-insulator-metal capacitor and metal gate transistor

Method of fabricating a microelectromechanical system (MEMS) switch

Structure and method of fabricating a hinge type MEMS switch

Modified via bottom structure for reliability enhancement

Semi-insulating diffusion barrier for low-resistivity gate conductors

Method for forming an atomically flat interface for a highly disordered metal-silicon barrier film

Capping layer for improved silicide formation in narrow semiconductor structures

Method of forming nitride films with high compressive stress for improved PFET device performance

Conversion of amorphous layer produced during IMP Ti deposition

High-temperature stable gate structure with metallic electrode

Interconnect structures with encasing cap and methods of making thereof

System level device for battery and integrated circuit integration

Chromium adhesion layer for copper vias in low-k technology

Copper vias in low-k technology

Electroplated interconnection structures on integrated circuit chips

Shared on-chip decoupling capacitor and heat-sink devices

Simultaneous formation of deep trench capacitor and resistor

Integrated metal-insulator-metal capacitor and metal gate transistor

Hybrid electronic mask

Polymer thin-film transistor with contact etch stops

Method of forming a planar polymer transistor using substrate bonding techniques

Flat interface for a metal-silicon contract barrier film

Flat interface for a metal-silicon contact barrier film

Ti liner for copper interconnect with low-k dielectric

Structure and method for MOSFET gate electrode landing pad

Thin film resistors of different materials

Polymer thin-film transistor with contact etch stops

Planar polymer transistor

Adhesion layer for Pt on SiO2

Method for enhanced uni-directional diffusion of metal and subsequent silicide formation

Process for manufacturing a contact barrier

Copper to aluminum interlayer interconnect using stud and via liner

Copper to aluminum interlayer interconnect using stud and via liner

Interconnect structures with encasing cap and methods of making thereof

CMP slurry additive for foreign matter detection

Modified via bottom structure for reliability enhancement

INFINEON TECHNOLOGIES AG

Liner with poor step coverage to improve contact resistance in W contacts

Methods for crystallizing metallic oxide dielectric films at low temperature

YUAN JUN

Self-aligned contact combined with a replacement metal gate/high-K gate dielectric

WONG KWONG HON

Pole mount for communication device

CLEVENGER LAWRENCE A

Structure and method for MOSFET gate electrode landing pad