Inventor

CHOI HEE-GUK

KR2 patents

Patents

2 patents

US7213329B2May 8, 2007

Method of forming a solder ball on a board and the board

SAMSUNG ELECTRONICS CO LTD32 citations86

US6432746B2Aug 13, 2002

Method for manufacturing a chip scale package having slits formed on a substrate

SAMSUNG ELECTRONICS CO LTD8 citations68