Inventor

AHN EUNCHUL

KR7 patents

⚠️ This page may combine multiple inventors who share the name “AHN EUNCHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents

US8053881B2Nov 8, 2011

Semiconductor package and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD10 citations82

US9035308B2May 19, 2015

Semiconductor package and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations60

US8759221B2Jun 24, 2014

Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packages

SAMSUNG ELECTRONICS CO LTD0 citations50

PARK JIN-WOO

2 patents

US8558400B2Oct 15, 2013

Semiconductor packages and methods of fabricating the same

PARK JIN-WOO4 citations61

US8497569B2Jul 30, 2013

Package substrates and semiconductor packages having the same

PARK JIN-WOO0 citations50

KIM YOUNG LYONG

1 patent

US8815731B2Aug 26, 2014

Semiconductor package and method of fabricating the same

KIM YOUNG LYONG5 citations66

AHN EUNCHUL

1 patent

US8491982B2Jul 23, 2013

Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the same

AHN EUNCHUL0 citations43