Inventor

OKUBO HIKARU

JP5 patents

⚠️ This page may combine multiple inventors who share the name “OKUBO HIKARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OKUBO HIKARU

2 patents

US8088308B2Jan 3, 2012

Resin composition and semiconductor device produced by using the same

OKUBO HIKARU5 citations69

US8614270B2Dec 24, 2013

Resin composition and semiconductor device produced by using the same

OKUBO HIKARU0 citations47

SUMITOMO BAKELITE CO

2 patents

US6861013B2Mar 1, 2005

Die-attaching paste and semiconductor device

SUMITOMO BAKELITE CO5 citations55

US8853312B2Oct 7, 2014

Resin composition and semiconductor device produced by using the same

SUMITOMO BAKELITE CO0 citations50

MASUDA TAKESHI

1 patent

US8217115B2Jul 10, 2012

Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package

MASUDA TAKESHI3 citations60