Inventor
KANAI SABUROU
JP23 patents
⚠️ This page may combine multiple inventors who share the name “KANAI SABUROU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
12 patentsUS6388382B1May 14, 2002
Plasma processing apparatus and method
HITACHI LTD78 citations96
US6172321B1Jan 9, 2001
Method and apparatus for plasma processing apparatus
HITACHI LTD26 citations93
US6034346AMar 7, 2000
Method and apparatus for plasma processing apparatus
HITACHI LTD27 citations93
US6756737B2Jun 29, 2004
Plasma processing apparatus and method
HITACHI LTD37 citations92
US6716301B2Apr 6, 2004
Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probe
HITACHI LTD25 citations92
US7288166B2Oct 30, 2007
Plasma processing apparatus
HITACHI LTD6 citations74
US6759338B2Jul 6, 2004
Plasma processing apparatus and method
HITACHI LTD9 citations74
US6649021B2Nov 18, 2003
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
HITACHI LTD9 citations74
US6491832B2Dec 10, 2002
Method for processing specimens
HITACHI LTD12 citations71
US7608162B2Oct 27, 2009
Plasma processing apparatus and method
HITACHI LTD4 citations63
US6867144B2Mar 15, 2005
Apparatus and method for plasma processing high-speed semiconductor circuits with increased yield
HITACHI LTD3 citations63
US6413876B1Jul 2, 2002
Method for plasma processing high-speed semiconductor circuits with increased yield
HITACHI LTD1 citations63
HITACHI HIGH TECH CORP
9 patentsUS6646233B2Nov 11, 2003
Wafer stage for wafer processing apparatus and wafer processing method
HITACHI HIGH TECH CORP89 citations98
US7138606B2Nov 21, 2006
Wafer processing method
HITACHI HIGH TECH CORP53 citations96
US6895179B2May 17, 2005
Wafer stage for wafer processing apparatus
HITACHI HIGH TECH CORP37 citations92
US6825617B2Nov 30, 2004
Semiconductor processing apparatus
HITACHI HIGH TECH CORP37 citations92
US6677167B2Jan 13, 2004
Wafer processing apparatus and a wafer stage and a wafer processing method
HITACHI HIGH TECH CORP39 citations92
US7833429B2Nov 16, 2010
Plasma processing method
HITACHI HIGH TECH CORP7 citations74
US7740739B2Jun 22, 2010
Plasma processing apparatus and method
HITACHI HIGH TECH CORP5 citations74
US7183715B2Feb 27, 2007
Method for operating a semiconductor processing apparatus
HITACHI HIGH TECH CORP2 citations63
US6914207B2Jul 5, 2005
Plasma processing method
HITACHI HIGH TECH CORP6 citations58