Inventor
KANERT WERNER
DE10 patents
⚠️ This page may combine multiple inventors who share the name “KANERT WERNER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
7 patentsUS10978418B2Apr 13, 2021
Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
INFINEON TECHNOLOGIES AG2 citations71
US10461056B2Oct 29, 2019
Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
INFINEON TECHNOLOGIES AG2 citations71
US12033972B2Jul 9, 2024
Chip package, method of forming a chip package and method of forming an electrical contact
INFINEON TECHNOLOGIES AG0 citations61
US9941181B2Apr 10, 2018
Chip package and method of forming a chip package
INFINEON TECHNOLOGIES AG0 citations50
US6670244B2Dec 30, 2003
Method for fabricating a body region for a vertical MOS transistor arrangement having a reduced on resistivity
INFINEON TECHNOLOGIES AG1 citations49
US10672678B2Jun 2, 2020
Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package
INFINEON TECHNOLOGIES AG0 citations39
US10497634B2Dec 3, 2019
Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound
INFINEON TECHNOLOGIES AG0 citations39