Inventor
ONG YEOW CHON
SG5 patents
Patents
5 patentsUS12506134B2Dec 23, 2025
Fan-out packaging for a multichip package
MICRON TECHNOLOGY INC0 citations58
US12368113B2Jul 22, 2025
Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices
MICRON TECHNOLOGY INC0 citations56
US12362247B2Jul 15, 2025
Semiconductor devices with flexible spacer including a support structure and methods of making the same
MICRON TECHNOLOGY INC0 citations55
US12080616B2Sep 3, 2024
Reinforced semiconductor device packaging and associated systems and methods
MICRON TECHNOLOGY INC0 citations55
US12438113B2Oct 7, 2025
Conductive adhesive assembly for semiconductor die attachment
MICRON TECHNOLOGY INC0 citations51