P

Inventor

MASUMURA HISASHI

JP36 patents
⚠️ This page may combine multiple inventors who share the name “MASUMURA HISASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINETSU HANDOTAI KK

30 patents
US5942445AAug 24, 1999

Method of manufacturing semiconductor wafers

SHINETSU HANDOTAI KK163 citations98
US6042688AMar 28, 2000

Carrier for double-side polishing

SHINETSU HANDOTAI KK54 citations96
US5951374ASep 14, 1999

Method of polishing semiconductor wafers

SHINETSU HANDOTAI KK57 citations96
US5800725ASep 1, 1998

Method of manufacturing semiconductor wafers

SHINETSU HANDOTAI KK80 citations96
US6135854AOct 24, 2000

Automatic workpiece transport apparatus for double-side polishing machine

SHINETSU HANDOTAI KK71 citations93
US5914053AJun 22, 1999

Apparatus and method for double-sided polishing semiconductor wafers

SHINETSU HANDOTAI KK39 citations93
US5827779AOct 27, 1998

Method of manufacturing semiconductor mirror wafers

SHINETSU HANDOTAI KK28 citations93
US7582221B2Sep 1, 2009

Wafer manufacturing method, polishing apparatus, and wafer

SHINETSU HANDOTAI KK33 citations92
US6332830B1Dec 25, 2001

Polishing method and polishing device

SHINETSU HANDOTAI KK24 citations92
US6120353ASep 19, 2000

Polishing method for semiconductor wafer and polishing pad used therein

SHINETSU HANDOTAI KK38 citations92
US5821167AOct 13, 1998

Method of manufacturing semiconductor mirror wafers

SHINETSU HANDOTAI KK24 citations92
US6422922B1Jul 23, 2002

Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece

SHINETSU HANDOTAI KK18 citations91
US6306021B1Oct 23, 2001

Polishing pad, polishing method, and polishing machine for mirror-polishing semiconductor wafers

SHINETSU HANDOTAI KK31 citations91
US5494862AFeb 27, 1996

Method of making semiconductor wafers

SHINETSU HANDOTAI KK47 citations91
US5447890ASep 5, 1995

Method for production of wafer

SHINETSU HANDOTAI KK20 citations91
US9266216B2Feb 23, 2016

Polishing head and polishing apparatus

SHINETSU HANDOTAI KK10 citations84
US6386957B1May 14, 2002

Workpiece holder for polishing, method for producing the same, method for polishing workpiece, and polishing apparatus

SHINETSU HANDOTAI KK17 citations83
US7740521B2Jun 22, 2010

Polishing head, polishing apparatus and polishing method for semiconductor wafer

SHINETSU HANDOTAI KK11 citations78
US5827395AOct 27, 1998

Polishing pad used for polishing silicon wafers and polishing method using the same

SHINETSU HANDOTAI KK12 citations74
US5759087AJun 2, 1998

Method for inducing damage for gettering to single crystal silicon wafer

SHINETSU HANDOTAI KK12 citations74
US5891353AApr 6, 1999

Polishing agent used for polishing semiconductor wafers and polishing method using the same

SHINETSU HANDOTAI KK6 citations73
US5866226AFeb 2, 1999

Polishing agent used for polishing semiconductor wafers and polishing method using the same

SHINETSU HANDOTAI KK8 citations73
US6558233B1May 6, 2003

Wafer polishing method, wafer cleaning method and wafer protective film

SHINETSU HANDOTAI KK7 citations71
US5790252AAug 4, 1998

Method of and apparatus for determining residual damage to wafer edges

SHINETSU HANDOTAI KK10 citations70
US5705423AJan 6, 1998

Epitaxial wafer

SHINETSU HANDOTAI KK9 citations69
US7695347B2Apr 13, 2010

Method and pad for polishing wafer

SHINETSU HANDOTAI KK7 citations67
US6399498B1Jun 4, 2002

Method and apparatus for polishing work

SHINETSU HANDOTAI KK2 citations63
US5667567ASep 16, 1997

Polishing agent used for polishing silicon wafers and polishing method using the same

SHINETSU HANDOTAI KK2 citations63
US8021210B2Sep 20, 2011

Polishing head and polishing apparatus having the same

SHINETSU HANDOTAI KK2 citations61
US6769966B2Aug 3, 2004

Workpiece holder for polishing, polishing apparatus and polishing method

SHINETSU HANDOTAI KK5 citations60

MASUMURA HISASHI

4 patents

SHIN ETSU HANDOTAI & CO LTD

1 patent

SHIN ETSU HANDOTAI CO LTD

1 patent