P

Inventor

HASHIMOTO HIROMASA

JP46 patents
⚠️ This page may combine multiple inventors who share the name “HASHIMOTO HIROMASA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINETSU HANDOTAI KK

18 patents
US5584746ADec 17, 1996

Method of polishing semiconductor wafers and apparatus therefor

SHINETSU HANDOTAI KK136 citations98
US5333413AAug 2, 1994

Automatic wafer lapping apparatus

SHINETSU HANDOTAI KK110 citations98
US5718620AFeb 17, 1998

Polishing machine and method of dissipating heat therefrom

SHINETSU HANDOTAI KK72 citations96
US5174067ADec 29, 1992

Automatic wafer lapping apparatus

SHINETSU HANDOTAI KK56 citations96
US5564965AOct 15, 1996

Polishing member and wafer polishing apparatus

SHINETSU HANDOTAI KK51 citations93
US5400547AMar 28, 1995

Polishing machine and method of dissipating heat therefrom

SHINETSU HANDOTAI KK26 citations92
US5101602AApr 7, 1992

Foam backing for use with semiconductor wafers

SHINETSU HANDOTAI KK25 citations92
US5788560AAug 4, 1998

Backing pad and method for polishing semiconductor wafer therewith

SHINETSU HANDOTAI KK27 citations86
US5157877AOct 27, 1992

Method for preparing a semiconductor wafer

SHINETSU HANDOTAI KK20 citations82
US7740521B2Jun 22, 2010

Polishing head, polishing apparatus and polishing method for semiconductor wafer

SHINETSU HANDOTAI KK11 citations78
US5335457AAug 9, 1994

Method of chucking semiconductor wafers

SHINETSU HANDOTAI KK19 citations74
US10744615B2Aug 18, 2020

Method for polishing wafer and polishing apparatus

SHINETSU HANDOTAI KK2 citations70
US8021210B2Sep 20, 2011

Polishing head and polishing apparatus having the same

SHINETSU HANDOTAI KK2 citations61
US11731236B2Aug 22, 2023

Method for selecting template assembly, method for polishing workpiece, and template assembly

SHINETSU HANDOTAI KK0 citations49
US9748089B2Aug 29, 2017

Method for producing mirror-polished wafer

SHINETSU HANDOTAI KK0 citations39
US10293460B2May 21, 2019

Method of producing polishing head and polishing apparatus

SHINETSU HANDOTAI KK0 citations38
US10707140B2Jul 7, 2020

Method for evaluating surface defects of substrate to be bonded

SHINETSU HANDOTAI KK0 citations36
US10460947B2Oct 29, 2019

Method for polishing silicon wafer

SHINETSU HANDOTAI KK0 citations32

TOYOTA MOTOR CO LTD

9 patents

JAPAN TOBACCO INC

7 patents

ZEON CORP

6 patents

HASHIMOTO HIROMASA

2 patents

FUJIKOSHI MACHINERY CORP

1 patent

SHIN ETSU HANDOTAI & CO LTD

1 patent

SASAKI TAKUYA

1 patent

MASUMURA HISASHI

1 patent