Inventor
LIN SHIH-CHI
TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN SHIH-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
29 patentsUS6287962B1Sep 11, 2001
Method for making a novel graded silicon nitride/silicon oxide (SNO) hard mask for improved deep sub-micrometer semiconductor processing
TAIWAN SEMICONDUCTOR MFG54 citations96
US6211057B1Apr 3, 2001
Method for manufacturing arch air gap in multilevel interconnection
TAIWAN SEMICONDUCTOR MFG67 citations96
US6130151AOct 10, 2000
Method of manufacturing air gap in multilevel interconnection
TAIWAN SEMICONDUCTOR MFG83 citations95
US6077733AJun 20, 2000
Method of manufacturing self-aligned T-shaped gate through dual damascene
TAIWAN SEMICONDUCTOR MFG115 citations95
US5950094ASep 7, 1999
Method for fabricating fully dielectric isolated silicon (FDIS)
TAIWAN SEMICONDUCTOR MFG94 citations94
US6518200B2Feb 11, 2003
Graded composite layer and method for fabrication thereof
TAIWAN SEMICONDUCTOR MFG39 citations92
US6429538B1Aug 6, 2002
Method for making a novel graded silicon nitride/silicon oxide (SNO) hard mask for improved deep sub-micrometer semiconductor processing
TAIWAN SEMICONDUCTOR MFG18 citations92
US6372645B1Apr 16, 2002
Methods to reduce metal bridges and line shorts in integrated circuits
TAIWAN SEMICONDUCTOR MFG22 citations92
US6069063AMay 30, 2000
Method to form polysilicon resistors shielded from hydrogen intrusion
TAIWAN SEMICONDUCTOR MFG25 citations92
US6660638B1Dec 9, 2003
CMP process leaving no residual oxide layer or slurry particles
TAIWAN SEMICONDUCTOR MFG13 citations91
US6436791B1Aug 20, 2002
Method of manufacturing a very deep STI (shallow trench isolation)
TAIWAN SEMICONDUCTOR MFG23 citations91
US6784077B1Aug 31, 2004
Shallow trench isolation process
TAIWAN SEMICONDUCTOR MFG47 citations90
US6171978B1Jan 9, 2001
Method of manufacturing capacitor dielectric
TAIWAN SEMICONDUCTOR MFG27 citations88
US7851358B2Dec 14, 2010
Low temperature method for minimizing copper hillock defects
TAIWAN SEMICONDUCTOR MFG8 citations84
US7635651B2Dec 22, 2009
Method of smoothening dielectric layer
TAIWAN SEMICONDUCTOR MFG12 citations84
US6573189B1Jun 3, 2003
Manufacture method of metal bottom ARC
TAIWAN SEMICONDUCTOR MFG17 citations84
US6218314B1Apr 17, 2001
Silicon dioxide-oxynitride continuity film as a passivation film
TAIWAN SEMICONDUCTOR MFG19 citations84
US7183199B2Feb 27, 2007
Method of reducing the pattern effect in the CMP process
TAIWAN SEMICONDUCTOR MFG10 citations83
US6815007B1Nov 9, 2004
Method to solve IMD-FSG particle and increase Cp yield by using a new tougher UFUN season film
TAIWAN SEMICONDUCTOR MFG14 citations83
US6472719B1Oct 29, 2002
Method of manufacturing air gap in multilevel interconnection
TAIWAN SEMICONDUCTOR MFG14 citations83
US6268267B1Jul 31, 2001
Silicon-oxynitride-oxide (SXO) continuity film pad to recessed bird's beak of LOCOS
TAIWAN SEMICONDUCTOR MFG9 citations74
US9385080B2Jul 5, 2016
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG4 citations73
US6585826B2Jul 1, 2003
Semiconductor wafer cleaning method to remove residual contamination including metal nitride particles
TAIWAN SEMICONDUCTOR MFG10 citations71
US6094275AJul 25, 2000
Apparatus and method for measuring optical properties of a coating layer
TAIWAN SEMICONDUCTOR MFG5 citations63
US7125802B2Oct 24, 2006
CMP process leaving no residual oxide layer or slurry particles
TAIWAN SEMICONDUCTOR MFG3 citations61
US6949448B2Sep 27, 2005
Local oxidation of silicon (LOCOS) method employing graded oxidation mask
TAIWAN SEMICONDUCTOR MFG0 citations52
US6903019B2Jun 7, 2005
CMP process leaving no residual oxide layer or slurry particles
TAIWAN SEMICONDUCTOR MFG0 citations51
US7368383B2May 6, 2008
Hillock reduction in copper films
TAIWAN SEMICONDUCTOR MFG1 citations49
US7611589B2Nov 3, 2009
Methods of spin-on wafer cleaning
TAIWAN SEMICONDUCTOR MFG1 citations48
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS10357867B2Jul 23, 2019
Polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US9589892B2Mar 7, 2017
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9718164B2Aug 1, 2017
Polishing system and polishing method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9601593B2Mar 21, 2017
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11670553B2Jun 6, 2023
Gate stack treatment
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US11088029B2Aug 10, 2021
Gate stack treatment
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US9966304B2May 8, 2018
Method for forming interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US11358252B2Jun 14, 2022
Method of using a polishing system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300549B2May 13, 2025
Gate stack treatment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US9287153B2Mar 15, 2016
Semiconductor baking apparatus and operation method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10840105B2Nov 17, 2020
Gate structure with insulating structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42