Inventor
LIAN BIN
US15 patents
⚠️ This page may combine multiple inventors who share the name “LIAN BIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
13 patentsUS6550531B1Apr 22, 2003
Vapor chamber active heat sink
INTEL CORP106 citations97
US6327145B1Dec 4, 2001
Heat sink with integrated fluid circulation pump
INTEL CORP100 citations97
US6521516B2Feb 18, 2003
Process for local on-chip cooling of semiconductor devices using buried microchannels
INTEL CORP75 citations96
US6752204B2Jun 22, 2004
Iodine-containing thermal interface material
INTEL CORP43 citations92
US6486589B1Nov 26, 2002
Circuit card assembly having controlled vibrational properties
INTEL CORP33 citations92
US6731221B1May 4, 2004
Electrically modifiable product labeling
INTEL CORP34 citations89
US6775122B1Aug 10, 2004
Circuit board with added impedance
INTEL CORP14 citations83
US6649937B2Nov 18, 2003
Semiconductor device with components embedded in backside diamond layer
INTEL CORP14 citations83
US6774310B1Aug 10, 2004
Surface mount connector lead
INTEL CORP9 citations73
US6359372B1Mar 19, 2002
Circuit card assembly having controlled expansion properties
INTEL CORP9 citations73
US6913999B2Jul 5, 2005
Semiconductor device with components embedded in backside diamond layer
INTEL CORP4 citations62
US6797085B1Sep 28, 2004
Metallurgically enhanced heat sink
INTEL CORP3 citations61
US7057114B2Jun 6, 2006
Circuit board with added impedance
INTEL CORP0 citations51