Inventor
SEARLS DAMION
US14 patents
⚠️ This page may combine multiple inventors who share the name “SEARLS DAMION”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS6903271B2Jun 7, 2005
Electronic assembly with thermally separated support
INTEL CORP18 citations92
US6752204B2Jun 22, 2004
Iodine-containing thermal interface material
INTEL CORP43 citations92
US6775122B1Aug 10, 2004
Circuit board with added impedance
INTEL CORP14 citations83
US6747873B1Jun 8, 2004
Channeled heat dissipation device and a method of fabrication
INTEL CORP15 citations81
US7230317B2Jun 12, 2007
Capacitor placement for integrated circuit packages
INTEL CORP11 citations80
US6906921B2Jun 14, 2005
Channeled heat dissipation device and a method of fabrication
INTEL CORP10 citations71
US6884087B2Apr 26, 2005
Socket with multiple contact pad area socket contacts
INTEL CORP7 citations71
US7145782B2Dec 5, 2006
Reducing loadline impedance in a system
INTEL CORP6 citations69
US6797085B1Sep 28, 2004
Metallurgically enhanced heat sink
INTEL CORP3 citations61
US12442712B2Oct 14, 2025
Liquid cooling system leak detection improvements
INTEL CORP0 citations55
US7057114B2Jun 6, 2006
Circuit board with added impedance
INTEL CORP0 citations51
US10555417B2Feb 4, 2020
Mainboard assembly including a package overlying a die directly attached to the mainboard
INTEL CORP0 citations48