Inventor
HUAN MARC
FR2 patents
Patents
2 patentsUS6754405B2Jun 22, 2004
Electronic assembly having high interconnection density
CIT ALCATEL4 citations56
US6683373B1Jan 27, 2004
Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained thereby
CIT ALCATEL2 citations51