Inventor

KATO TADAHIRO

JP35 patents

⚠️ This page may combine multiple inventors who share the name “KATO TADAHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KATO TADAHIRO

SHINETSU HANDOTAI KK

Method of manufacturing semiconductor wafers

Method of polishing semiconductor wafers

Method of manufacturing semiconductor wafers

Semiconductor wafer and production method therefor

Method for production of silicon wafer and apparatus therefor

Method and apparatus for high-flatness etching of wafer

Semiconductor wafer processing method and semiconductor wafers produced by the same

Semiconductor wafers processing method and semiconductor wafers produced by the same

Surface grinding device and method of surface grinding a thin-plate workpiece

Double-sided simultaneous grinding method, double-sided simultaneous grinding machine, double-sided simultaneous lapping method, and double-sided simultaneous lapping machine

Manufacturing process for semiconductor wafer

Method of making semiconductor wafers

Method for production of wafer

Method and apparatus for surface-grinding of workpiece

Method for slicing workpiece by using wire saw and wire saw

Method for producing semiconductor wafer and semiconductor wafer

Method for processing semiconductor wafer and semiconductor wafer

Semiconductor wafer and device for semiconductor device manufacturing process

Semiconductor wafer processing method and semiconductor wafers produced by the same

Processing method for a wafer

Surface grinding method and apparatus for thin plate work

Workpiece double-disc grinding apparatus and workpiece double-disc grinding method

Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece

Chamfering apparatus and method for manufacturing notchless wafer

Method of improving nanotopography of surface of wafer and wire saw apparatus

Outer periphery polishing apparatus for disc-shaped workpiece

KANSAI PAINT CO LTD

Coating method with crosslinked coatings from two coat-one bake systems

Decorative film for use in plastics molding, process for preparing the same and injection-molded part by use of the same

Decorative film for use in plastics molding, process for preparing the same and injection-molded part by use of the same

KATO TADAHIRO

Chamfering apparatus for silicon wafer, method for producing silicon wafer, and etched silicon wafer

Wafer production method

Method for manufacturing bonded wafer

SHIN ESTU HANDOTAI CO LTD

Method and device for grinding double sides of thin disk work

MITSUBISHI HEAVY IND LTD

Multiform gas heat pump type air conditioning system

KOBAYASHI KENJI

Double-disc grinding apparatus and method for producing wafer