Inventor

CELAYA PHILLIP C

US5 patents

⚠️ This page may combine multiple inventors who share the name “CELAYA PHILLIP C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOTOROLA INC

3 patents

US6093972AJul 25, 2000

Microelectronic package including a polymer encapsulated die

MOTOROLA INC125 citations96

US5895229AApr 20, 1999

Microelectronic package including a polymer encapsulated die, and method for forming same

MOTOROLA INC128 citations96

US5808873ASep 15, 1998

Electronic component assembly having an encapsulation material and method of forming the same

MOTOROLA INC135 citations92

SEMICONDUCTOR COMPONENTS IND

2 patents

US6889429B2May 10, 2005

Method of making a lead-free integrated circuit package

SEMICONDUCTOR COMPONENTS IND37 citations88

US7180170B2Feb 20, 2007

Lead-free integrated circuit package structure

SEMICONDUCTOR COMPONENTS IND2 citations58