Inventor

SIEPE DIRK

DE9 patents

⚠️ This page may combine multiple inventors who share the name “SIEPE DIRK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SIEPE DIRK

3 patents

US8164176B2Apr 24, 2012

Semiconductor module arrangement

SIEPE DIRK10 citations81

US9196562B2Nov 24, 2015

Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate

SIEPE DIRK4 citations70

US8541892B2Sep 24, 2013

Bonding connection between a bonding wire and a power semiconductor chip

SIEPE DIRK0 citations48

INFINEON TECHNOLOGIES AG

3 patents

US7851913B2Dec 14, 2010

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

INFINEON TECHNOLOGIES AG6 citations61

US7654434B2Feb 2, 2010

Method, device and system for bonding a semiconductor element

INFINEON TECHNOLOGIES AG2 citations61

US7597235B2Oct 6, 2009

Apparatus and method for producing a bonding connection

INFINEON TECHNOLOGIES AG2 citations60

BAYERER REINHOLD

1 patent

US8198721B2Jun 12, 2012

Semiconductor module

BAYERER REINHOLD0 citations50

ROTH ROMAN

1 patent

US8955219B2Feb 17, 2015

Method for fabricating a bond

ROTH ROMAN0 citations43

HARTUNG HANS

1 patent

US9129934B2Sep 8, 2015

Power semiconductor module and method for operating a power semiconductor module

HARTUNG HANS1 citations41