Inventor

TATEIWA AKIHIKO

JP25 patents

⚠️ This page may combine multiple inventors who share the name “TATEIWA AKIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TATEIWA AKIHIKO

SHINKO ELECTRIC IND CO

Semiconductor package and manufacturing method

Semiconductor package including a metal plate, semiconductor chip, and wiring structure, semiconductor apparatus and method for manufacturing semiconductor package

Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components

Tape fiber and method for treating same

Optical collimator structure

Manufacturing method of semiconductor package

Method of manufacturing semiconductor element mounted wiring board

Electrostatic adsorption member and substrate fixing device

Semiconductor package, semiconductor device, and method for manufacturing semiconductor package

Package for semiconductor device and method of manufacturing the same

Wiring substrate having multiple core substrates

KOIZUMI NAOYUKI

Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same

Module substrate including optical transmission mechanism and method of producing the same

Wiring substrate, semiconductor device and manufacturing method thereof

UCHIYAMA KENTA

Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer

Semiconductor device, manufacturing method thereof, and electronic device

Wiring board with lead pins and method of producing the same

KUNIMOTO YUJI

Fine wiring package and method of manufacturing the same

Resin-sealed package and method of producing the same

KYOZUKA MASAHIRO

Semiconductor package and method for manufacturing semiconductor package

Semiconductor package and manufacturing method therefor

TATEIWA AKIHIKO

Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same

FURUICHI JUN

Wiring substrate and method of manufacturing the same

CHINO TERUAKI

Semiconductor package with its surface edge covered by resin

HIZUME TOHRU

Method of manufacturing semiconductor package