Inventor

TAN KIM HWEE

SG6 patents

⚠️ This page may combine multiple inventors who share the name “TAN KIM HWEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANPACK SOLUTIONS PTE LTD

2 patents

US6550666B2Apr 22, 2003

Method for forming a flip chip on leadframe semiconductor package

ADVANPACK SOLUTIONS PTE LTD250 citations95

US7462942B2Dec 9, 2008

Die pillar structures and a method of their formation

ADVANPACK SOLUTIONS PTE LTD149 citations91

AGERE SYST GUARDIAN CORP

1 patent

US6319450B1Nov 20, 2001

Encapsulated circuit using vented mold

AGERE SYST GUARDIAN CORP26 citations89

LUCENT TECHNOLOGIES INC

1 patent

US6199464B1Mar 13, 2001

Method and apparatus for cutting a substrate

LUCENT TECHNOLOGIES INC5 citations57

MICRO DEVICES CORP CALIFORNIA

1 patent

US7541251B2Jun 2, 2009

Wire bond and redistribution layer process

MICRO DEVICES CORP CALIFORNIA3 citations54

HAMAMOTO MITCHELL M

1 patent

US8058712B2Nov 15, 2011

Device having wire bond and redistribution layer

HAMAMOTO MITCHELL M2 citations48