Inventor
SIMION BOGDAN M
US8 patents
⚠️ This page may combine multiple inventors who share the name “SIMION BOGDAN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS7829195B2Nov 9, 2010
Fluorination pre-treatment of heat spreader attachment indium thermal interface material
INTEL CORP2 citations60
US9899362B2Feb 20, 2018
Mold chase for integrated circuit package assembly and associated techniques and configurations
INTEL CORP1 citations50
US9067342B2Jun 30, 2015
Mold chase for integrated circuit package assembly and associated techniques and configurations
INTEL CORP0 citations50
US8366982B2Feb 5, 2013
Differential pressure underfill process and equipment
INTEL CORP0 citations50