P

Inventor

WANG CHEN-CHAO

US33 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHEN-CHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

25 patents
US10276382B2Apr 30, 2019

Semiconductor device packages and stacked package assemblies including high density interconnections

ADVANCED SEMICONDUCTOR ENG27 citations93
US10886263B2Jan 5, 2021

Stacked semiconductor package assemblies including double sided redistribution layers

ADVANCED SEMICONDUCTOR ENG9 citations85
US10535521B2Jan 14, 2020

Semiconductor device packages and stacked package assemblies including high density interconnections

ADVANCED SEMICONDUCTOR ENG6 citations83
US10515806B2Dec 24, 2019

Semiconductor device packages and stacked package assemblies including high density interconnections

ADVANCED SEMICONDUCTOR ENG5 citations83
US8841751B2Sep 23, 2014

Through silicon vias for semiconductor devices and manufacturing method thereof

ADVANCED SEMICONDUCTOR ENG6 citations83
US10916429B2Feb 9, 2021

Semiconductor device packages and stacked package assemblies including high density interconnections

ADVANCED SEMICONDUCTOR ENG1 citations72
US11901245B2Feb 13, 2024

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG2 citations70
US11232998B2Jan 25, 2022

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG3 citations68
US11844199B2Dec 12, 2023

Electronic device

ADVANCED SEMICONDUCTOR ENG3 citations66
US10236240B2Mar 19, 2019

Low loss substrate for high data rate applications

ADVANCED SEMICONDUCTOR ENG2 citations66
US12132006B2Oct 29, 2024

Semiconductor package structure

ADVANCED SEMICONDUCTOR ENG0 citations62
US11605877B2Mar 14, 2023

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations62
US10903561B2Jan 26, 2021

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US12216157B2Feb 4, 2025

Package structure and testing method

ADVANCED SEMICONDUCTOR ENG0 citations61
US11733294B2Aug 22, 2023

Package structure and testing method

ADVANCED SEMICONDUCTOR ENG1 citations61
US11222845B2Jan 11, 2022

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG0 citations61
US12394676B2Aug 19, 2025

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations59
US11424167B2Aug 23, 2022

Semiconductor package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations59
US11328999B2May 10, 2022

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG0 citations57
US11515249B2Nov 29, 2022

Wiring package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations55
US10903152B2Jan 26, 2021

Low loss substrate for high data rate applications

ADVANCED SEMICONDUCTOR ENG0 citations55
US12564078B2Feb 24, 2026

Electronic package

ADVANCED SEMICONDUCTOR ENG0 citations52
US12176305B2Dec 24, 2024

Semiconductor package with integrated voltage regulator device and separate bridge die

ADVANCED SEMICONDUCTOR ENG0 citations52
US9728451B2Aug 8, 2017

Through silicon vias for semiconductor devices and manufacturing method thereof

ADVANCED SEMICONDUCTOR ENG0 citations51
US10186779B2Jan 22, 2019

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations44

MASSACHUSETTS INST TECHNOLOGY

2 patents

WANG CHEN-CHAO

2 patents

THERICS LLC

1 patent

GUERINO FRANK

1 patent

INTERVET INC

1 patent

DU PONT

1 patent