Inventor
WANG CHEN-CHAO
US33 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHEN-CHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
25 patentsUS10276382B2Apr 30, 2019
Semiconductor device packages and stacked package assemblies including high density interconnections
ADVANCED SEMICONDUCTOR ENG27 citations93
US10886263B2Jan 5, 2021
Stacked semiconductor package assemblies including double sided redistribution layers
ADVANCED SEMICONDUCTOR ENG9 citations85
US10535521B2Jan 14, 2020
Semiconductor device packages and stacked package assemblies including high density interconnections
ADVANCED SEMICONDUCTOR ENG6 citations83
US10515806B2Dec 24, 2019
Semiconductor device packages and stacked package assemblies including high density interconnections
ADVANCED SEMICONDUCTOR ENG5 citations83
US8841751B2Sep 23, 2014
Through silicon vias for semiconductor devices and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG6 citations83
US10916429B2Feb 9, 2021
Semiconductor device packages and stacked package assemblies including high density interconnections
ADVANCED SEMICONDUCTOR ENG1 citations72
US11901245B2Feb 13, 2024
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations70
US11232998B2Jan 25, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG3 citations68
US11844199B2Dec 12, 2023
Electronic device
ADVANCED SEMICONDUCTOR ENG3 citations66
US10236240B2Mar 19, 2019
Low loss substrate for high data rate applications
ADVANCED SEMICONDUCTOR ENG2 citations66
US12132006B2Oct 29, 2024
Semiconductor package structure
ADVANCED SEMICONDUCTOR ENG0 citations62
US11605877B2Mar 14, 2023
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US10903561B2Jan 26, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US12216157B2Feb 4, 2025
Package structure and testing method
ADVANCED SEMICONDUCTOR ENG0 citations61
US11733294B2Aug 22, 2023
Package structure and testing method
ADVANCED SEMICONDUCTOR ENG1 citations61
US11222845B2Jan 11, 2022
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations61
US12394676B2Aug 19, 2025
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations59
US11424167B2Aug 23, 2022
Semiconductor package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations59
US11328999B2May 10, 2022
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations57
US11515249B2Nov 29, 2022
Wiring package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations55
US10903152B2Jan 26, 2021
Low loss substrate for high data rate applications
ADVANCED SEMICONDUCTOR ENG0 citations55
US12564078B2Feb 24, 2026
Electronic package
ADVANCED SEMICONDUCTOR ENG0 citations52
US12176305B2Dec 24, 2024
Semiconductor package with integrated voltage regulator device and separate bridge die
ADVANCED SEMICONDUCTOR ENG0 citations52
US9728451B2Aug 8, 2017
Through silicon vias for semiconductor devices and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations51
US10186779B2Jan 22, 2019
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations44
MASSACHUSETTS INST TECHNOLOGY
2 patentsUS7276252B2Oct 2, 2007
Method and form of a drug delivery device, such as encapsulating a toxic core within a non-toxic region in an oral dosage form
MASSACHUSETTS INST TECHNOLOGY54 citations95
US7875290B2Jan 25, 2011
Method and form of a drug delivery device, such as encapsulating a toxic core within a non-toxic region in an oral dosage form
MASSACHUSETTS INST TECHNOLOGY27 citations91