Inventor
NAGAI YUSUKE
JP83 patents
⚠️ This page may combine multiple inventors who share the name “NAGAI YUSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
25 patentsUS7435607B2Oct 14, 2008
Method of wafer laser processing using a gas permeable protective tape
DISCO CORP113 citations98
US7364986B2Apr 29, 2008
Laser beam processing method and laser beam machine
DISCO CORP121 citations98
US7682858B2Mar 23, 2010
Wafer processing method including formation of a deteriorated layer
DISCO CORP18 citations84
US7329564B2Feb 12, 2008
Wafer dividing method
DISCO CORP12 citations84
US7232741B2Jun 19, 2007
Wafer dividing method
DISCO CORP13 citations84
US7223937B2May 29, 2007
Laser beam processing method and laser beam processing machine
DISCO CORP14 citations84
US7179722B2Feb 20, 2007
Wafer dividing method
DISCO CORP20 citations84
US7179721B2Feb 20, 2007
Method of dividing a non-metal substrate
DISCO CORP14 citations84
US7141443B2Nov 28, 2006
Semiconductor wafer dividing method utilizing laser beam
DISCO CORP19 citations84
US7179724B2Feb 20, 2007
Wafer processing method
DISCO CORP11 citations82
US7618878B2Nov 17, 2009
Wafer dividing method
DISCO CORP6 citations74
US7470566B2Dec 30, 2008
Wafer dividing method
DISCO CORP6 citations74
US7279403B2Oct 9, 2007
Plate-like workpiece dividing apparatus
DISCO CORP7 citations74
US7134943B2Nov 14, 2006
Wafer processing method
DISCO CORP10 citations74
US7063083B2Jun 20, 2006
Wafer dividing method and apparatus
DISCO CORP8 citations73
US7553777B2Jun 30, 2009
Silicon wafer laser processing method and laser beam processing machine
DISCO CORP2 citations63
US7497213B2Mar 3, 2009
Wafer dividing apparatus
DISCO CORP6 citations63
US7350446B2Apr 1, 2008
Wafer dividing apparatus
DISCO CORP6 citations63
US7348199B2Mar 25, 2008
Wafer dividing method
DISCO CORP5 citations63
US7332415B2Feb 19, 2008
Silicon wafer dividing method and apparatus
DISCO CORP6 citations63
US7244938B2Jul 17, 2007
Method of checking a laser processed deteriorated layer
DISCO CORP3 citations63
US7134942B2Nov 14, 2006
Wafer processing method
DISCO CORP6 citations63
US7602071B2Oct 13, 2009
Apparatus for dividing an adhesive film mounted on a wafer
DISCO CORP3 citations62
US7449396B2Nov 11, 2008
Wafer dividing method
DISCO CORP4 citations62
US7549560B2Jun 23, 2009
Wafer dividing method
DISCO CORP6 citations60
TDK CORP
11 patentsUS11810704B2Nov 7, 2023
Multilayer coil component
TDK CORP4 citations72
US12300409B2May 13, 2025
Multilayer coil device and method of manufacturing the same
TDK CORP0 citations62
US12087484B2Sep 10, 2024
Multilayer coil component
TDK CORP0 citations62
US11710593B2Jul 25, 2023
Multilayer coil component
TDK CORP0 citations62
US11302466B2Apr 12, 2022
Multilayer coil electronic component
TDK CORP1 citations62
US12354785B2Jul 8, 2025
Multilayer coil component
TDK CORP0 citations61
US12040111B2Jul 16, 2024
Multilayer coil component
TDK CORP0 citations61
US11605483B2Mar 14, 2023
Composite magnetic body and electronic component
TDK CORP0 citations61
US12573539B2Mar 10, 2026
Coil-type electronic component
TDK CORP0 citations60
US12440892B2Oct 14, 2025
Soft magnetic alloy powder, soft magnetic sintered body, and coil-type electronic component
TDK CORP0 citations60
US12444530B2Oct 14, 2025
Multilayer coil component
TDK CORP0 citations60
MITSUI MINING & SMELTING CO LTD
4 patentsUS11266982B2Mar 8, 2022
Exhaust gas purification catalyst
MITSUI MINING & SMELTING CO LTD11 citations83
US11208931B2Dec 28, 2021
Exhaust gas purification catalyst
MITSUI MINING & SMELTING CO LTD7 citations83
US11433377B2Sep 6, 2022
Exhaust gas purification catalyst and production method therefor
MITSUI MINING & SMELTING CO LTD6 citations74
US11913367B2Feb 27, 2024
Exhaust gas purification catalyst
MITSUI MINING & SMELTING CO LTD1 citations61
SHIMADZU CORP
3 patentsHITACHI IND EQUIPMENT SYS
1 patentMITSUI MINING & SMELTING CO
1 patentFUJIMOTO HIDEKI
1 patentNAGAI YUSUKE
1 patentSHARP KK
1 patentYAZAKI CORP
1 patentTAIYO YUDEN KK
1 patentShowing the top 50 of 83 patents by PatentIndex Score.