P

Inventor

NAGAI YUSUKE

JP83 patents
⚠️ This page may combine multiple inventors who share the name “NAGAI YUSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DISCO CORP

25 patents
US7435607B2Oct 14, 2008

Method of wafer laser processing using a gas permeable protective tape

DISCO CORP113 citations98
US7364986B2Apr 29, 2008

Laser beam processing method and laser beam machine

DISCO CORP121 citations98
US7682858B2Mar 23, 2010

Wafer processing method including formation of a deteriorated layer

DISCO CORP18 citations84
US7329564B2Feb 12, 2008

Wafer dividing method

DISCO CORP12 citations84
US7232741B2Jun 19, 2007

Wafer dividing method

DISCO CORP13 citations84
US7223937B2May 29, 2007

Laser beam processing method and laser beam processing machine

DISCO CORP14 citations84
US7179722B2Feb 20, 2007

Wafer dividing method

DISCO CORP20 citations84
US7179721B2Feb 20, 2007

Method of dividing a non-metal substrate

DISCO CORP14 citations84
US7141443B2Nov 28, 2006

Semiconductor wafer dividing method utilizing laser beam

DISCO CORP19 citations84
US7179724B2Feb 20, 2007

Wafer processing method

DISCO CORP11 citations82
US7618878B2Nov 17, 2009

Wafer dividing method

DISCO CORP6 citations74
US7470566B2Dec 30, 2008

Wafer dividing method

DISCO CORP6 citations74
US7279403B2Oct 9, 2007

Plate-like workpiece dividing apparatus

DISCO CORP7 citations74
US7134943B2Nov 14, 2006

Wafer processing method

DISCO CORP10 citations74
US7063083B2Jun 20, 2006

Wafer dividing method and apparatus

DISCO CORP8 citations73
US7553777B2Jun 30, 2009

Silicon wafer laser processing method and laser beam processing machine

DISCO CORP2 citations63
US7497213B2Mar 3, 2009

Wafer dividing apparatus

DISCO CORP6 citations63
US7350446B2Apr 1, 2008

Wafer dividing apparatus

DISCO CORP6 citations63
US7348199B2Mar 25, 2008

Wafer dividing method

DISCO CORP5 citations63
US7332415B2Feb 19, 2008

Silicon wafer dividing method and apparatus

DISCO CORP6 citations63
US7244938B2Jul 17, 2007

Method of checking a laser processed deteriorated layer

DISCO CORP3 citations63
US7134942B2Nov 14, 2006

Wafer processing method

DISCO CORP6 citations63
US7602071B2Oct 13, 2009

Apparatus for dividing an adhesive film mounted on a wafer

DISCO CORP3 citations62
US7449396B2Nov 11, 2008

Wafer dividing method

DISCO CORP4 citations62
US7549560B2Jun 23, 2009

Wafer dividing method

DISCO CORP6 citations60

TDK CORP

11 patents

MITSUI MINING & SMELTING CO LTD

4 patents

SHIMADZU CORP

3 patents

HITACHI IND EQUIPMENT SYS

1 patent

MITSUI MINING & SMELTING CO

1 patent

FUJIMOTO HIDEKI

1 patent

NAGAI YUSUKE

1 patent

SHARP KK

1 patent

YAZAKI CORP

1 patent

TAIYO YUDEN KK

1 patent

Showing the top 50 of 83 patents by PatentIndex Score.