Inventor
LIN YING-REN
TW7 patents
⚠️ This page may combine multiple inventors who share the name “LIN YING-REN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
6 patentsUS7271483B2Sep 18, 2007
Bump structure of semiconductor package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD76 citations97
US7173828B2Feb 6, 2007
Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure
SILICONWARE PRECISION INDUSTRIES CO LTD106 citations97
US6865084B2Mar 8, 2005
Thermally enhanced semiconductor package with EMI shielding
SILICONWARE PRECISION INDUSTRIES CO LTD120 citations96
US7180183B2Feb 20, 2007
Semiconductor device with reinforced under-support structure and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD15 citations81
US7348211B2Mar 25, 2008
Method for fabricating semiconductor packages
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations62
US7129119B2Oct 31, 2006
Method for fabricating semiconductor packages
SILICONWARE PRECISION INDUSTRIES CO LTD5 citations62