Inventor
IWAI SUSUMU
JP12 patents
⚠️ This page may combine multiple inventors who share the name “IWAI SUSUMU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
11 patentsUS5646824AJul 8, 1997
Electronic equipment and lap-top type electronic equipment
HITACHI LTD155 citations99
US5077601ADec 31, 1991
Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
HITACHI LTD204 citations99
US5313362AMay 17, 1994
Packaging structure of small-sized computer
HITACHI LTD159 citations98
US5796580AAug 18, 1998
Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels
HITACHI LTD237 citations97
US5358032AOct 25, 1994
LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted
HITACHI LTD73 citations96
US5428503AJun 27, 1995
Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
HITACHI LTD96 citations93
US5805417ASep 8, 1998
Heat dissipation structure in a portable computer including a heat dissipation block extending from a heat dissipation plate through a first circuit board to a CPU on a second circuit board
HITACHI LTD22 citations92
US6185481B1Feb 6, 2001
Air cooled electronic equipment apparatus
HITACHI LTD42 citations90
US6094343AJul 25, 2000
Heat dissipation structure for electronic equipment including two heat dissipation block assemblies and a heat conductive coupler
HITACHI LTD14 citations81
US6094344AJul 25, 2000
Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates
HITACHI LTD8 citations73
US6156427ADec 5, 2000
Electroconductive resin composition for molding and electromagnetic wave interference shield structure molded from the composition
HITACHI LTD12 citations70