Inventor
YANG CHING-HSU
TW3 patents
Patents
3 patentsUS7446409B2Nov 4, 2008
Cavity-down multiple-chip package
ADVANCED SEMICONDUCTOR ENG13 citations78
US7224057B2May 29, 2007
Thermal enhance package with universal heat spreader
ADVANCED SEMICONDUCTOR ENG18 citations78
US6972489B2Dec 6, 2005
Flip chip package with thermometer
ADVANCED SEMICONDUCTOR ENG2 citations59