Inventor
YAMUNAN VINU
US8 patents
Patents
8 patentsUS6917098B1Jul 12, 2005
Three-level leadframe for no-lead packages
TEXAS INSTRUMENTS INC65 citations94
US6869831B2Mar 22, 2005
Adhesion by plasma conditioning of semiconductor chip surfaces
TEXAS INSTRUMENTS INC35 citations94
US7319275B2Jan 15, 2008
Adhesion by plasma conditioning of semiconductor chip
TEXAS INSTRUMENTS INC5 citations71
US6977429B2Dec 20, 2005
Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
TEXAS INSTRUMENTS INC9 citations71
US7445960B2Nov 4, 2008
Adhesion by plasma conditioning of semiconductor chip
TEXAS INSTRUMENTS INC1 citations60
US7276401B2Oct 2, 2007
Adhesion by plasma conditioning of semiconductor chip surfaces
TEXAS INSTRUMENTS INC1 citations60
US7271494B2Sep 18, 2007
Adhesion by plasma conditioning of semiconductor chip surfaces
TEXAS INSTRUMENTS INC1 citations60
US7323362B2Jan 29, 2008
Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
TEXAS INSTRUMENTS INC1 citations49