Inventor
KIM DONG-JOON
KR62 patents
⚠️ This page may combine multiple inventors who share the name “KIM DONG-JOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
10 patentsUS7084420B2Aug 1, 2006
Nitride based semiconductor device
SAMSUNG ELECTRO MECH488 citations99
US7173288B2Feb 6, 2007
Nitride semiconductor light emitting device having electrostatic discharge (ESD) protection capacity
SAMSUNG ELECTRO MECH77 citations98
US7187007B2Mar 6, 2007
Nitride semiconductor device and method of manufacturing the same
SAMSUNG ELECTRO MECH40 citations92
US7294864B2Nov 13, 2007
Flip chip type nitride semiconductor light-emitting diode
SAMSUNG ELECTRO MECH18 citations84
US7135716B2Nov 14, 2006
Gallium nitride-based semiconductor light-emitting device
SAMSUNG ELECTRO MECH11 citations84
US7811902B2Oct 12, 2010
Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based light emitting diode using the same
SAMSUNG ELECTRO MECH7 citations74
US7687294B2Mar 30, 2010
Nitride semiconductor device and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations63
US7018912B2Mar 28, 2006
Fabrication method of nitride semiconductors and nitride semiconductor structure fabricated thereby
SAMSUNG ELECTRO MECH4 citations63
US7192884B2Mar 20, 2007
Method for manufacturing semiconductor laser device
SAMSUNG ELECTRO MECH2 citations56
US7067401B2Jun 27, 2006
Fabrication method of nitride semiconductors and nitride semiconductor structure fabricated thereby
SAMSUNG ELECTRO MECH1 citations52
MAGNACHIP SEMICONDUCTOR LTD
7 patentsUS7948043B2May 24, 2011
MEMS package that includes MEMS device wafer bonded to cap wafer and exposed array pads
MAGNACHIP SEMICONDUCTOR LTD7 citations84
US7557441B2Jul 7, 2009
Package of MEMS device and method for fabricating the same
MAGNACHIP SEMICONDUCTOR LTD5 citations74
US7615394B2Nov 10, 2009
Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer
MAGNACHIP SEMICONDUCTOR LTD3 citations63
US9419206B2Aug 16, 2016
Magnetic sensor and method of fabricating the same
MAGNACHIP SEMICONDUCTOR LTD2 citations61
US8357560B2Jan 22, 2013
Package of MEMS device and method for fabricating the same
MAGNACHIP SEMICONDUCTOR LTD1 citations52
USRE41653ESep 7, 2010
Method of forming metal wiring of semiconductor device
MAGNACHIP SEMICONDUCTOR LTD0 citations52
US7220675B2May 22, 2007
Method of forming metal wiring of semiconductor device
MAGNACHIP SEMICONDUCTOR LTD0 citations52
SAMSUNG LED CO LTD
6 patentsUS7994525B2Aug 9, 2011
Nitride-based semiconductor light emitting diode
SAMSUNG LED CO LTD477 citations98
US8030640B2Oct 4, 2011
Nitride semiconductor light emitting device and method of manufacturing the same
SAMSUNG LED CO LTD9 citations84
US7888670B2Feb 15, 2011
Nitride semiconductor light emitting device
SAMSUNG LED CO LTD16 citations83
US7893447B2Feb 22, 2011
Nitride-based semiconductor light emitting diode
SAMSUNG LED CO LTD4 citations73
US7977134B2Jul 12, 2011
Nitride-based semiconductor light emitting diode and method of manufacturing the same
SAMSUNG LED CO LTD2 citations62
US7893443B2Feb 22, 2011
Nitride based semiconductor light-emitting device
SAMSUNG LED CO LTD3 citations62
HYNIX SEMICONDUCTOR INC
4 patentsUS6656841B1Dec 2, 2003
Method of forming multi layer conductive line in semiconductor device
HYNIX SEMICONDUCTOR INC56 citations96
US6912770B2Jul 5, 2005
Method for fabricating magnetic field sensor
HYNIX SEMICONDUCTOR INC2 citations63
US6825124B2Nov 30, 2004
Method of forming metal line in semiconductor device
HYNIX SEMICONDUCTOR INC4 citations63
US6693040B2Feb 17, 2004
Method for cleaning the contact area of a metal line
HYNIX SEMICONDUCTOR INC4 citations63
SAMSUNG ELECTRONICS CO LTD
4 patentsUS5612768AMar 18, 1997
Image forming apparatus with an air ventilation structure for preventing contamination of charging device
SAMSUNG ELECTRONICS CO LTD39 citations93
US9000460B2Apr 7, 2015
Semiconductor light emitting device
SAMSUNG ELECTRONICS CO LTD7 citations82
US6438998B1Aug 27, 2002
Ultrasonic dispersion apparatus for silica sol
SAMSUNG ELECTRONICS CO LTD16 citations82
US6173149B1Jan 9, 2001
Transfer roller of an electrophotographic printing apparatus for protecting photoconductive drum from staining and method of manufacturing transfer roller
SAMSUNG ELECTRONICS CO LTD11 citations74
KANG SANG WON
2 patentsKIM DONG-JOON
2 patentsKOREA ELECTROTECH RES INST
2 patentsUS7818159B2Oct 19, 2010
Intelligent system and method for monitoring generator reactive power limit using machine model parameters
KOREA ELECTROTECH RES INST12 citations82
US7236898B2Jun 26, 2007
System and method for calculating real-time voltage stability risk index in power system using time series data
KOREA ELECTROTECH RES INST9 citations71
SK HYNIX INC
2 patents(unassigned)
1 patentGAURIAN CORP
1 patentROTIS INC ROAD TRAFFIC INFORMA
1 patentROTIS INC
1 patentLG INNOTEK CO LTD
1 patentSAMSUNG LED LTD
1 patentSAMSUNG ELECTONICS CO LTD
1 patentGAURIAN CO LTD
1 patentSCHWARTZ DAVID M
1 patentLEE HYUK MIN
1 patentCJ CHEILJEDANG CORP
1 patentShowing the top 50 of 62 patents by PatentIndex Score.