Inventor
BERGER DANIEL GEORGE
US11 patents
⚠️ This page may combine multiple inventors who share the name “BERGER DANIEL GEORGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS6528145B1Mar 4, 2003
Polymer and ceramic composite electronic substrates
IBM208 citations98
US5775569AJul 7, 1998
Method for building interconnect structures by injection molded solder and structures built
IBM120 citations98
US6149122ANov 21, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM61 citations95
US6133633AOct 17, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM40 citations95
US6340630B1Jan 22, 2002
Method for making interconnect for low temperature chip attachment
IBM28 citations91
US6127735AOct 3, 2000
Interconnect for low temperature chip attachment
IBM41 citations91
US7405247B2Jul 29, 2008
Conductive adhesive composition
IBM26 citations90
US7312261B2Dec 25, 2007
Thermal interface adhesive and rework
IBM24 citations90
US6020750AFeb 1, 2000
Wafer test and burn-in platform using ceramic tile supports
IBM45 citations88
US7393419B2Jul 1, 2008
Conductive adhesive rework method
IBM14 citations82