Inventor · disambiguated record
Ennis T. Ogawa
Also filed as: OGAWA ENNIS · OGAWA ENNIS T · OGAWA ENNIS TAKASHI
7 granted patents·1 pending application·64 citations·filing 2002–2017
84Inventor score
Top patents by PatentIndex Score
8 records- 0185US7888776B2Capacitor-based method for determining and characterizing scribe seal integrity and integrity lossTEXAS INSTRUMENTS INC·Filed 2008·Granted Feb 15, 2011·12 cites·19 claims
- 0273US6919639B2Multiple copper vias for integrated circuit metallization and methods of fabricating sameUNIV TEXAS·Filed 2002·Granted Jul 19, 2005·18 cites·18 claims
- 0368US6737351B2Versatile system for diffusion limiting void formationTEXAS INSTRUMENTS INC·Filed 2002·Granted May 18, 2004·13 cites·21 claims
- 0465US7033924B2Versatile system for diffusion limiting void formationTEXAS INSTRUMENTS INC·Filed 2003·Granted Apr 25, 2006·11 cites·21 claims
- 0564US7566652B2Electrically inactive via for electromigration reliability improvementTEXAS INSTRUMENTS INC·Filed 2006·Granted Jul 28, 2009·3 cites·17 claims
- 0658US7078817B2Multiple copper vias for integrated circuit metallizationUNIV TEXAS·Filed 2004·Granted Jul 18, 2006·7 cites·23 claims
- 0742US10629504B2Die edge crack and delamination detectionAVAGO TECH INT SALES PTE LID·Filed 2017·Granted Apr 21, 2020·0 cites·20 claims
- 0833US2008246491A1Scalable method for identifying cracks and fractures under wired or ball bonded bond padsTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
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