Inventor
CHA MING-HONG
TW8 patents
⚠️ This page may combine multiple inventors who share the name “CHA MING-HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS11088102B2Aug 10, 2021
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10468366B2Nov 5, 2019
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9673161B2Jun 6, 2017
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11075173B2Jul 27, 2021
Semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations71
US12598995B2Apr 7, 2026
Semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
TAIWAN SEMICONDUCTOR MFG
3 patentsUS8829673B2Sep 9, 2014
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG17 citations92
US9397059B2Jul 19, 2016
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG4 citations73
US9123788B2Sep 1, 2015
Bonded structures for package and substrate
TAIWAN SEMICONDUCTOR MFG1 citations62