Inventor
OKUNO EIICHI
JP50 patents
⚠️ This page may combine multiple inventors who share the name “OKUNO EIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
39 patentsUS6573534B1Jun 3, 2003
Silicon carbide semiconductor device
DENSO CORP285 citations99
US6455892B1Sep 24, 2002
Silicon carbide semiconductor device and method for manufacturing the same
DENSO CORP206 citations98
US6221700B1Apr 24, 2001
Method of manufacturing silicon carbide semiconductor device with high activation rate of impurities
DENSO CORP105 citations98
US6165822ADec 26, 2000
Silicon carbide semiconductor device and method of manufacturing the same
DENSO CORP109 citations97
US6482704B1Nov 19, 2002
Method of manufacturing silicon carbide semiconductor device having oxide film formed thereon with low on-resistances
DENSO CORP77 citations96
US6452228B1Sep 17, 2002
Silicon carbide semiconductor device
DENSO CORP50 citations96
US7994513B2Aug 9, 2011
Silicon carbide semiconductor device including deep layer
DENSO CORP23 citations93
US7824995B2Nov 2, 2010
SiC semiconductor device and method for manufacturing the same
DENSO CORP21 citations93
US7825449B2Nov 2, 2010
Silicon carbide semiconductor device and related manufacturing method
DENSO CORP36 citations92
US6103423AAug 15, 2000
Negative electrode for secondary cells and a non-aqueous electrolyte secondary cell comprising the same as at least one electrode
DENSO CORP29 citations92
US7365363B2Apr 29, 2008
Silicon carbide semiconductor device and method for manufacturing the same
DENSO CORP44 citations91
US7915705B2Mar 29, 2011
SiC semiconductor device having outer periphery structure
DENSO CORP9 citations84
US7893467B2Feb 22, 2011
Silicon carbide semiconductor device having junction barrier Schottky diode
DENSO CORP18 citations84
US7863682B2Jan 4, 2011
SIC semiconductor having junction barrier Schottky diode
DENSO CORP19 citations84
US7855412B2Dec 21, 2010
Silicon carbide semiconductor device and method of manufacturing the same
DENSO CORP9 citations84
US7851882B2Dec 14, 2010
Silicon carbide semiconductor device having junction barrier schottky diode
DENSO CORP13 citations84
US7825017B2Nov 2, 2010
Method of making silicon carbide semiconductor device having multi-layered passivation film with uneven surfaces
DENSO CORP8 citations84
US7816733B2Oct 19, 2010
SiC semiconductor having junction barrier schottky device
DENSO CORP9 citations84
US7808003B2Oct 5, 2010
Silicon carbide semiconductor device
DENSO CORP13 citations84
US7745276B2Jun 29, 2010
Method for manufacturing SiC semiconductor device
DENSO CORP8 citations84
US7645658B2Jan 12, 2010
Method of manufacturing silicon carbide semiconductor device
DENSO CORP11 citations84
US7947555B2May 24, 2011
Method of making silicon carbide semiconductor device
DENSO CORP8 citations83
US6841436B2Jan 11, 2005
Method of fabricating SiC semiconductor device
DENSO CORP16 citations83
US7045879B2May 16, 2006
Silicon carbide semiconductor device having enhanced carrier mobility
DENSO CORP7 citations71
US7851854B2Dec 14, 2010
SiC semiconductor device having bottom layer and method for manufacturing the same
DENSO CORP3 citations63
US7838888B2Nov 23, 2010
Silcon carbide semiconductor device having schottky barrier diode and method for manufacturing the same
DENSO CORP7 citations63
US7470930B2Dec 30, 2008
Silicon carbide semiconductor device
DENSO CORP2 citations63
US7569496B2Aug 4, 2009
Method for manufacturing SiC semiconductor device
DENSO CORP4 citations62
US7968892B2Jun 28, 2011
Silicon carbide semiconductor device
DENSO CORP3 citations61
US7993966B2Aug 9, 2011
Method for manufacturing silicon carbide semiconductor device having high channel mobility
DENSO CORP1 citations52
US7763893B2Jul 27, 2010
Silicon carbide semiconductor device
DENSO CORP0 citations52
US7713805B2May 11, 2010
Method of manufacturing silicon carbide semiconductor device
DENSO CORP1 citations52
US11431474B2Aug 30, 2022
Verification terminal and verification system
DENSO CORP0 citations51
US11374942B2Jun 28, 2022
Verification terminal
DENSO CORP0 citations51
US10155895B2Dec 18, 2018
Composite heat storage material
DENSO CORP1 citations51
US10126072B2Nov 13, 2018
Heat storage unit and heat storage system
DENSO CORP1 citations51
US10864922B2Dec 15, 2020
Wakefulness maintenance apparatus
DENSO CORP0 citations49
US9998196B2Jun 12, 2018
Antenna device and high-frequency transmitter
DENSO CORP0 citations34
US10563997B2Feb 18, 2020
Multisensory interface control method, multisensory interface control apparatus, and multisensory interface system
DENSO CORP0 citations32