Inventor
XING RUI YUAN
CN4 patents
Patents
4 patentsUS10790260B2Sep 29, 2020
Plasma activation treatment for wafer bonding
YANGTZE MEMORY TECH CO LTD4 citations68
US10679854B2Jun 9, 2020
Wafer bonding method and structure thereof
YANGTZE MEMORY TECH CO LTD2 citations65
US11257706B2Feb 22, 2022
Semiconductor device flipping apparatus
YANGTZE MEMORY TECH CO LTD1 citations57
US11342185B2May 24, 2022
Wafer bonding method and structure thereof
YANGTZE MEMORY TECH CO LTD0 citations55