Inventor

Wang xiao jin

CN2 patents

Patents

2 patents

US10679854B2Jun 9, 2020

Wafer bonding method and structure thereof

YANGTZE MEMORY TECH CO LTD2 citations65

US11342185B2May 24, 2022

Wafer bonding method and structure thereof

YANGTZE MEMORY TECH CO LTD0 citations55