Inventor

LU YU-TE

TW21 patents

⚠️ This page may combine multiple inventors who share the name “LU YU-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LU YU-TE

KINSUS INTERCONNECT TECH CORP

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole

Method of fabricating board having high density core layer and structure thereof

Double sided board with buried element and method for manufacturing the same

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Method for fabricating buried capacitor structure

Method for manufacturing multi-layer circuit board capable of being applied with electrical testing

Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same

Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof

Stacked multilayer structure

Chip support board structure

Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same

Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing

Method of manufacturing a multilayer substrate structure for fine line

Method of manufacturing a stacked multilayer structure

Package structure of a chip and a substrate

Method of manufacturing a chip support board structure

Method of manufacturing a laminate circuit board

CHANG CHIEN-WEI

Method for fabricating component-embedded printed circuit board

Method of fabricating board having high density core layer and structure thereof

Method for fabricating an interlayer conducting structure of an embedded circuitry