Inventor

DAS RABINDRA N

US47 patents

⚠️ This page may combine multiple inventors who share the name “DAS RABINDRA N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAS RABINDRA N

MASSACHUSETTS INST TECHNOLOGY

Qubit and coupler circuit structures and coupling techniques

Shielded through via structures and methods for fabricating shielded through via structures

Interconnect structures and methods for fabricating interconnect structures

Cryogenic electronic packages and assemblies

Cryogenic electronic packages and methods for fabricating cryogenic electronic packages

Interconnect structures for assembly of multi-layer semiconductor devices

Multi-layer semiconductor structure and methods for fabricating multi-layer semiconductor structures

Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits

Semiconductor structures for assembly in multi-layer semiconductor devices including at least one semiconductor structure

Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages

Interconnect structures for assembly of multi-layer semiconductor devices

Multi-layer semiconductor devices fabricated using a combination of substrate and via structures and fabrication techniques

Superconducting integrated circuit

Interconnect structures for assembly of semiconductor structures including at least one integrated circuit structure

Interconnect structures for fine pitch assembly of semiconductor structures and related techniques

DAS RABINDRA N

Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate

Substrate having internal capacitor and method of making same

Anti-tamper microchip package based on thermal nanofluids or fluids

Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates

Circuitized substrate with low loss capacitive material and method of making same

Electrically conductive adhesive (ECA) for multilayer device interconnects

Method of forming multilayer capacitors in a printed circuit substrate

Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate

Multi-layer embedded capacitance and resistance substrate core

Method of making a circuitized substrate

Conducting paste for device level interconnects

Method of forming an electrically conductive printed line

Method of making a circuitized substrate

Circuitized substrate with dielectric interposer assembly and method

ENDICOTT INTERCONNECT TECH INC

Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate

Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Multi-layer embedded capacitance and resistance substrate core

Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate

Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate

Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate

Capacitive substrate

Method of making circuitized substrate with a resistor

Capacitive substrate and method of making same

MARKOVICH VOYA R

Electronic package with thermal interposer and method of making same

Solder and electrically conductive adhesive based interconnection for CZT crystal attach

Method of joining a semiconductor device/chip to a printed wiring board

MARKOVICH VOYA

Coreless layer buildup structure

Coreless layer buildup structure with LGA

Coreless layer buildup structure with LGA and joining layer

ENDICOTT INTERCONECT TECHNOLOG

Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate

Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate