Inventor
LIN HOW T
US31 patents
⚠️ This page may combine multiple inventors who share the name “LIN HOW T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ENDICOTT INTERCONNECT TECH INC
16 patentsUS7292055B2Nov 6, 2007
Interposer for use with test apparatus
ENDICOTT INTERCONNECT TECH INC66 citations98
US6828514B2Dec 7, 2004
High speed circuit board and method for fabrication
ENDICOTT INTERCONNECT TECH INC47 citations96
US7841741B2Nov 30, 2010
LED lighting assembly and lamp utilizing same
ENDICOTT INTERCONNECT TECH INC54 citations93
US7738249B2Jun 15, 2010
Circuitized substrate with internal cooling structure and electrical assembly utilizing same
ENDICOTT INTERCONNECT TECH INC32 citations93
US7541058B2Jun 2, 2009
Method of making circuitized substrate with internal optical pathway
ENDICOTT INTERCONNECT TECH INC20 citations93
US7441709B2Oct 28, 2008
Electronic card assembly
ENDICOTT INTERCONNECT TECH INC22 citations92
US7713767B2May 11, 2010
Method of making circuitized substrate with internal optical pathway using photolithography
ENDICOTT INTERCONNECT TECH INC13 citations84
US7511518B2Mar 31, 2009
Method of making an interposer
ENDICOTT INTERCONNECT TECH INC14 citations84
US7429510B2Sep 30, 2008
Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate
ENDICOTT INTERCONNECT TECH INC15 citations84
US7152319B2Dec 26, 2006
Method of making high speed circuit board
ENDICOTT INTERCONNECT TECH INC12 citations84
US7045897B2May 16, 2006
Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same
ENDICOTT INTERCONNECT TECH INC14 citations84
US7629559B2Dec 8, 2009
Method of improving electrical connections in circuitized substrates
ENDICOTT INTERCONNECT TECH INC7 citations73
US7326643B2Feb 5, 2008
Method of making circuitized substrate with internal organic memory device
ENDICOTT INTERCONNECT TECH INC6 citations73
US7897877B2Mar 1, 2011
Capacitive substrate
ENDICOTT INTERCONNECT TECH INC5 citations63
US7253502B2Aug 7, 2007
Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same
ENDICOTT INTERCONNECT TECH INC2 citations62
US7803688B2Sep 28, 2010
Capacitive substrate and method of making same
ENDICOTT INTERCONNECT TECH INC1 citations52
IBM
10 patentsUS5290992AMar 1, 1994
Apparatus for maximizing light beam utilization
IBM35 citations93
US6635866B2Oct 21, 2003
Multi-functional fiber optic coupler
IBM51 citations92
US6712261B2Mar 30, 2004
Solid conductive element insertion apparatus
IBM25 citations91
US6527457B2Mar 4, 2003
Optical fiber guide module and a method for making the same
IBM11 citations74
US7130522B2Oct 31, 2006
Method and structure for two-dimensional optical fiber ferrule
IBM2 citations63
US7108809B2Sep 19, 2006
Optical coupler replication arrangement and process
IBM2 citations62
US6982387B2Jan 3, 2006
Method and apparatus to establish circuit layers interconnections
IBM2 citations61
US6827505B2Dec 7, 2004
Optoelectronic package structure and process for planar passive optical and optoelectronic devices
IBM4 citations60
US6651013B1Nov 18, 2003
Method and apparatus for determining the location of a short in an electrical wire network
IBM1 citations49
US6644864B2Nov 11, 2003
Stacked optical coupler
IBM0 citations42