P

Inventor

LIN HOW T

US31 patents
⚠️ This page may combine multiple inventors who share the name “LIN HOW T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ENDICOTT INTERCONNECT TECH INC

16 patents
US7292055B2Nov 6, 2007

Interposer for use with test apparatus

ENDICOTT INTERCONNECT TECH INC66 citations98
US6828514B2Dec 7, 2004

High speed circuit board and method for fabrication

ENDICOTT INTERCONNECT TECH INC47 citations96
US7841741B2Nov 30, 2010

LED lighting assembly and lamp utilizing same

ENDICOTT INTERCONNECT TECH INC54 citations93
US7738249B2Jun 15, 2010

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

ENDICOTT INTERCONNECT TECH INC32 citations93
US7541058B2Jun 2, 2009

Method of making circuitized substrate with internal optical pathway

ENDICOTT INTERCONNECT TECH INC20 citations93
US7441709B2Oct 28, 2008

Electronic card assembly

ENDICOTT INTERCONNECT TECH INC22 citations92
US7713767B2May 11, 2010

Method of making circuitized substrate with internal optical pathway using photolithography

ENDICOTT INTERCONNECT TECH INC13 citations84
US7511518B2Mar 31, 2009

Method of making an interposer

ENDICOTT INTERCONNECT TECH INC14 citations84
US7429510B2Sep 30, 2008

Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate

ENDICOTT INTERCONNECT TECH INC15 citations84
US7152319B2Dec 26, 2006

Method of making high speed circuit board

ENDICOTT INTERCONNECT TECH INC12 citations84
US7045897B2May 16, 2006

Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same

ENDICOTT INTERCONNECT TECH INC14 citations84
US7629559B2Dec 8, 2009

Method of improving electrical connections in circuitized substrates

ENDICOTT INTERCONNECT TECH INC7 citations73
US7326643B2Feb 5, 2008

Method of making circuitized substrate with internal organic memory device

ENDICOTT INTERCONNECT TECH INC6 citations73
US7897877B2Mar 1, 2011

Capacitive substrate

ENDICOTT INTERCONNECT TECH INC5 citations63
US7253502B2Aug 7, 2007

Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same

ENDICOTT INTERCONNECT TECH INC2 citations62
US7803688B2Sep 28, 2010

Capacitive substrate and method of making same

ENDICOTT INTERCONNECT TECH INC1 citations52

IBM

10 patents

DAS RABINDRA N

2 patents

PIERSON MARK V

1 patent

ENDICOTT INTERCONECT TECHNOLOG

1 patent

MARKOVICH VOYA R

1 patent