Inventor

MARKOVICH VOYA R

US175 patents

⚠️ This page may combine multiple inventors who share the name “MARKOVICH VOYA R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MARKOVICH VOYA R

IBM

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Method of preparing a printed circuit board

Method for making printed circuit boards with selectivity filled plated through holes

Economical high density chip carrier

Two signal one power plane circuit board

Composite laminate circuit structure and method of forming the same

High density circuit board and method of making same

Method of fabricating nendritic materials

Method for making a printed wiring board

Composite laminate circuit structure and method of forming the same

Conductive substructures of a multilayered laminate

Interconnection method and structure for organic circuit boards

Separable electrical connection technology

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Full additive process with filled plated through holes

Copper plated PTH barrels and methods for fabricating

Composite laminate circuit structure and methods of interconnecting the same

Composite laminate circuit structure and methods of interconnecting the same

Interconnect structure for joining a chip to a circuit card

Method for conditioning halogenated polymeric materials and structures fabricated therewith

Solder interconnection structure on organic substrates and process for making

Encapsulated circuitized power core alignment and lamination

Solder interconnection structure on organic substrates

Multi-level thin-film electronic packaging structure and related method

Applying solder to high density substrates

Interconnection method and structure for organic circuit boards

Method of making a parallel capacitor laminate

Capacitor laminate for use in printed circuit board and as an interconnector

Process for selective application of solder to circuit packages

Method and apparatus for testing integrated circuit chips

Printed circuit board with aligned connections and method of making same

Method and apparatus for testing of integrated circuit chips

Printed circuit board or card for direct chip attachment and fabrication thereof

Laminate circuit structure and method of fabricating

Laminate circuit structure and method of fabricating

Process for manufacturing a multi-layer circuit board

Method and apparatus for testing integrated circuit chips

ENDICOTT INTERCONNECT TECH INC

Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same

High speed circuit board and method for fabrication

Circuitized substrate assembly and method of making same

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

Method of making circuitized substrate with internal optical pathway

Interposer and test assembly for testing electronic devices

Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate

Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate

Electronic card assembly

Method of providing printed circuit board with conductive holes and board resulting therefrom

Method of making multilayered printed circuit board with filled conductive holes

Printed circuit board with low cross-talk noise

DAS RABINDRA N

Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate