Inventor
Shen wen-wei
TW15 patents
⚠️ This page may combine multiple inventors who share the name “Shen wen-wei”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS9773755B2Sep 26, 2017
Substrate interconnections having different sizes
TAIWAN SEMICONDUCTOR MFG CO LTD16 citations92
US9768138B2Sep 19, 2017
Improving the strength of micro-bump joints
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11502015B2Nov 15, 2022
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11424219B2Aug 23, 2022
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US12148678B2Nov 19, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080681B2Sep 3, 2024
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
Shen wen-wei
4 patentsUS9142533B2Sep 22, 2015
Substrate interconnections having different sizes
Shen wen-wei18 citations92
US8901736B2Dec 2, 2014
Strength of micro-bump joints
Shen wen-wei15 citations91
US8241963B2Aug 14, 2012
Recessed pillar structure
Shen wen-wei18 citations83
US8178970B2May 15, 2012
Strong interconnection post geometry
Shen wen-wei3 citations62