Inventor

CHUANG YAO-CHUN

TW72 patents

⚠️ This page may combine multiple inventors who share the name “CHUANG YAO-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

29 patents

US10784223B2Sep 22, 2020

Elongated bump structures in package structure

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US10056345B2Aug 21, 2018

Conical-shaped or tier-shaped pillar connections

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84

US9881885B2Jan 30, 2018

Metal routing architecture for integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84

US9472521B2Oct 18, 2016

Scheme for connector site spacing and resulting structures

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US11088102B2Aug 10, 2021

Bonded structures for package and substrate

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US10692848B2Jun 23, 2020

Stress reduction apparatus and method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US10515917B2Dec 24, 2019

Bump on pad (BOP) bonding structure in semiconductor packaged device

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US10468366B2Nov 5, 2019

Bonded structures for package and substrate

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73

US9991218B2Jun 5, 2018

Connector structures of integrated circuits

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US9741589B2Aug 22, 2017

Substrate pad structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

US9673125B2Jun 6, 2017

Interconnection structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US9673161B2Jun 6, 2017

Bonded structures for package and substrate

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

US9053990B2Jun 9, 2015

Bump interconnection techniques

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73

US11728262B2Aug 15, 2023

Metal plate corner structure on metal insulator metal

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71

US11855025B2Dec 26, 2023

Semiconductor device and package assembly including the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11315896B2Apr 26, 2022

Conical-shaped or tier-shaped pillar connections

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12382587B2Aug 5, 2025

Methods and systems for improving surface mount joinder

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12322716B2Jun 3, 2025

Heat dissipating features for laser drilling process

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12113055B2Oct 8, 2024

Stress reduction apparatus and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11244940B2Feb 8, 2022

Stress reduction apparatus and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12424558B2Sep 23, 2025

Bridge die having different surface orientation than IC dies interconnected by the bridge die

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

US12107041B2Oct 1, 2024

Metal plate corner structure on metal insulator metal

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

US12354975B2Jul 8, 2025

Guard ring structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

US12288735B2Apr 29, 2025

Through via structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

US12575356B2Mar 10, 2026

Edge profile control of integrated circuit chips

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59

US12334465B2Jun 17, 2025

Semiconductor package and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59

US11984422B2May 14, 2024

Semiconductor package and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59

US11342291B2May 24, 2022

Semiconductor packages with crack preventing structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59

US12068300B2Aug 20, 2024

Chip-on-wafer-on-substrate package with improved yield

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations58

TAIWAN SEMICONDUCTOR MFG

10 patents

US9224688B2Dec 29, 2015

Metal routing architecture for integrated circuits

TAIWAN SEMICONDUCTOR MFG17 citations93

US9117825B2Aug 25, 2015

Substrate pad structure

TAIWAN SEMICONDUCTOR MFG12 citations92

US8829673B2Sep 9, 2014

Bonded structures for package and substrate

TAIWAN SEMICONDUCTOR MFG17 citations92

US9093440B2Jul 28, 2015

Connector structures of integrated circuits

TAIWAN SEMICONDUCTOR MFG6 citations84

US9397059B2Jul 19, 2016

Bonded structures for package and substrate

TAIWAN SEMICONDUCTOR MFG4 citations73

US9196573B2Nov 24, 2015

Bump on pad (BOP) bonding structure

TAIWAN SEMICONDUCTOR MFG2 citations63

US9159695B2Oct 13, 2015

Elongated bump structures in package structure

TAIWAN SEMICONDUCTOR MFG3 citations63

US8772950B2Jul 8, 2014

Methods and apparatus for flip chip substrate with guard rings outside of a die attach region

TAIWAN SEMICONDUCTOR MFG3 citations63

US9373598B2Jun 21, 2016

Connector structures of integrated circuits

TAIWAN SEMICONDUCTOR MFG1 citations62

US9123788B2Sep 1, 2015

Bonded structures for package and substrate

TAIWAN SEMICONDUCTOR MFG1 citations62

CHUANG YAO-CHUN

5 patents

US8299616B2Oct 30, 2012

T-shaped post for semiconductor devices

CHUANG YAO-CHUN24 citations92

US8232643B2Jul 31, 2012

Lead free solder interconnections for integrated circuits

CHUANG YAO-CHUN12 citations84

US9257412B2Feb 9, 2016

Stress reduction apparatus

CHUANG YAO-CHUN6 citations83

US8659123B2Feb 25, 2014

Metal pad structures in dies

CHUANG YAO-CHUN4 citations73

US8476759B2Jul 2, 2013

Electrical connection structure

CHUANG YAO-CHUN2 citations62

KUO TIN-HAO

1 patent

US9425136B2Aug 23, 2016

Conical-shaped or tier-shaped pillar connections

KUO TIN-HAO24 citations93

Shen wen-wei

1 patent

US8241963B2Aug 14, 2012

Recessed pillar structure

Shen wen-wei18 citations83

SHEN CHENG HUNG

1 patent

US8227924B2Jul 24, 2012

Substrate stand-offs for semiconductor devices

SHEN CHENG HUNG9 citations78

HSIAO CHING-WEN

1 patent

US8847387B2Sep 30, 2014

Robust joint structure for flip-chip bonding

HSIAO CHING-WEN5 citations72

CHUANG CHITA

1 patent

US9905524B2Feb 27, 2018

Bump structures in semiconductor device and packaging assembly

CHUANG CHITA4 citations70

REALTEK SEMICONDUCTOR CORP

1 patent

US11258461B2Feb 22, 2022

Data processing device and method

REALTEK SEMICONDUCTOR CORP0 citations57

Showing the top 50 of 72 patents by PatentIndex Score.