Inventor

RINNE GLENN A

US47 patents

⚠️ This page may combine multiple inventors who share the name “RINNE GLENN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RINNE GLENN A

UNITIVE INT LTD

Controlled-shaped solder reservoirs for increasing the volume of solder bumps

Methods for forming integrated redistribution routing conductors and solder bumps

Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby

Key-shaped solder bumps and under bump metallurgy

Optical structures including liquid bumps and related methods

Methods of forming bumps using barrier layers as etch masks

Methods of forming electronic structures including conductive shunt layers and related structures

Electronic structures including conductive shunt layers

Electronic structures including barrier layers defining lips

Stacked electronic structures including offset substrates

Non-Circular via holes for bumping pads and related structures

Electroplating methods including maintaining a determined electroplating voltage and related systems

Methods of providing solder structures for out plane connections

Low temperature methods of bonding components and related structures

Solder structures for out of plane connections

Methods of forming electronic structures including conductive shunt layers and related structures

MCNC

Method for testing, burn-in, and/or programming of integrated circuit chips

Microelectronic packaging using arched solder columns

Solder bumps and structures for integrated redistribution routing conductors

Methods for modulating a radiation signal

Modulatable reflectors and methods for using same

Microelectronic packaging using arched solder columns

Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon

Method of forming differing volume solder bumps

Methods of electroplating solder bumps of uniform height on integrated circuit substrates

Microelectronic radiation detectors for detecting and emitting radiation signals

Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon

Variable size capture pads for multilayer ceramic substrates and connectors therefor

Fluorinated fluxless soldering

Fluorinated fluxless soldering

Electrical connector including variably spaced connector contacts

AMKOR TECHNOLOGY INC

Semiconductor device and manufacturing method thereof

Electronic devices including solder bumps on compliant dielectric layers

Capacitor and resistor having anodic metal and anodic metal oxide structure

Methods of forming metal layers using multi-layer lift-off patterns

Methods of forming back side layers for thinned wafers

Semiconductor device and manufacturing method thereof

Lead free alloy bump structure and fabrication method

Semiconductor device and manufacturing method thereof

UNITIVE ELECTRONICS INC

Trilayer/bilayer solder bumps and fabrication methods therefor

Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles

Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween

Methods of positioning components using liquid prime movers and related structures

RINNE GLENN A

Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods

Wafers including patterned back side layers thereon

UNITIVIE INTERNAT LTD

Low temperature methods of bonding components

NAIR KRISHNA K

Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers