Inventor

CHEN MING-FA

TW446 patents

⚠️ This page may combine multiple inventors who share the name “CHEN MING-FA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN MING-FA

TAIWAN SEMICONDUCTOR MFG CO LTD

System on integrated chips and methods of forming same

Packages formed using RDL-last process

Packages with Si-substrate-free interposer and method forming same

Integrated circuit package and method of forming same

Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate vias

Three-dimensional integrated circuit structure

Semiconductor structure and a manufacturing method thereof

System on integrated chips and methods of forming same

3D stacked-chip package

3DIC structure with protective structure and method of fabricating the same

Semiconductor structure and manufacturing method thereof

3DIC structure with protective structure and method of fabricating the same and package

Packages with si-substrate-free interposer and method forming same

Interconnect structure and method

Semiconductor structure and manufacturing method thereof

3DIC formation with dies bonded to formed RDLs

3D chip-on-wafer-on-substrate structure with via last process

Method of forming semiconductor device package having testing pads on a topmost die

3DIC structure and method of manufacturing the same

Seal ring for hybrid-bond

Package structure for heat dissipation

Structure and formation method for chip package

Chip-on-wafer package and method of forming same

3D stacked-chip package

3DIC structure and method of manufacturing the same

Substrate interconnections having different sizes

Semiconductor package and method of manufacturing semiconductor package

Method for manufacturing a semiconductor device having an interconnect structure over a substrate

Integrated circuit package and method

Semiconductor package and manufacturing method of semiconductor package

Semiconductor structure having photonic die and electronic die

Package and manufacturing method thereof

Semiconductor structure and method of fabricating the same

Package structure with photonic die and method

Integrating passive devices in package structures

CHEN MING-FA

Through-substrate vias and methods for forming the same

Method of forming stacked dies

Wafer backside interconnect structure connected to TSVs

Through-silicon via with low-K dielectric liner

Connecting through vias to devices

Stacked integrated chips and methods of fabrication thereof

TAIWAN SEMICONDUCTOR MFG

Dummy wafers in 3DIC package assemblies

Through-silicon via with scalloped sidewalls

Through-silicon via with air gap

Integrated circuits and methods of forming the same

Isolation structure for protecting dielectric layers from degradation

Photomask arrangement protecting reticle patterns from electrostatic discharge damage (ESD)

Shen wen-wei

Substrate interconnections having different sizes

Strength of micro-bump joints

CHIU MING-YEN

Dummy pattern in wafer backside routing