Inventor

KAO PERRE

TW4 patents

⚠️ This page may combine multiple inventors who share the name “KAO PERRE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

3 patents

US11488891B2Nov 1, 2022

Method of forming conductive bumps for cooling device connection and semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

US9899296B2Feb 20, 2018

Method of forming conductive bumps for cooling device connection

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61

US10651111B2May 12, 2020

Method of forming conductive bumps for cooling device connection

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

CHOU YOU-HUA

1 patent

US8941232B2Jan 27, 2015

Metal bumps for cooling device connection

CHOU YOU-HUA2 citations60