P

Inventor

CHONG DAVID

MY10 patents
⚠️ This page may combine multiple inventors who share the name “CHONG DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FAIRCHILD SEMICONDUCTOR

4 patents
US6891257B2May 10, 2005

Packaging system for die-up connection of a die-down oriented integrated circuit

FAIRCHILD SEMICONDUCTOR79 citations96
US7579680B2Aug 25, 2009

Packaging system for semiconductor devices

FAIRCHILD SEMICONDUCTOR1 citations50
US7323361B2Jan 29, 2008

Packaging system for semiconductor devices

FAIRCHILD SEMICONDUCTOR1 citations50
US9159656B2Oct 13, 2015

Semiconductor die package and method for making the same

FAIRCHILD SEMICONDUCTOR0 citations49

INTEL CORP

1 patent
US4621319ANov 4, 1986

Personal development system

INTEL CORP28 citations83

JEON OSEOB

1 patent
US8664752B2Mar 4, 2014

Semiconductor die package and method for making the same

JEON OSEOB9 citations80

LUMILEDS LLC

1 patent
US10916683B2Feb 9, 2021

Contact etching and metallization for improved LED device performance and reliability

LUMILEDS LLC0 citations61

CHONG DAVID

1 patent
US10529894B2Jan 7, 2020

Contact etching and metallization for improved LED device performance and reliability

CHONG DAVID0 citations44

KUMAR JATINDER

1 patent
US8525321B2Sep 3, 2013

Conductive chip disposed on lead semiconductor package

KUMAR JATINDER1 citations44

LIM LAY YEAP

1 patent
US8110447B2Feb 7, 2012

Method of making and designing lead frames for semiconductor packages

LIM LAY YEAP0 citations32