Inventor
TAKASHIMA KOUICHI
JP13 patents
⚠️ This page may combine multiple inventors who share the name “TAKASHIMA KOUICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO ELECTRIC INDUSTRIES
4 patentsUS7180178B2Feb 20, 2007
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor
SUMITOMO ELECTRIC INDUSTRIES7 citations72
US12252766B2Mar 18, 2025
Composite material, heat sink and semiconductor device
SUMITOMO ELECTRIC INDUSTRIES0 citations56
US6979901B2Dec 27, 2005
Semiconductor heat-dissipating substrate, and manufacturing method and package therefor
SUMITOMO ELECTRIC INDUSTRIES1 citations51
US5990548ANov 23, 1999
Plate type member for semiconductor device package and package
SUMITOMO ELECTRIC INDUSTRIES1 citations51
NITTO DENKO CORP
3 patentsUS6077360AJun 20, 2000
Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same
NITTO DENKO CORP50 citations95
US4956132ASep 11, 1990
Method for applying mold-releasing agent onto mold surfaces using a mold-releasing sheet
NITTO DENKO CORP11 citations70
US5925605AJul 20, 1999
Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same
NITTO DENKO CORP1 citations51
ALMT CORP
2 patentsTAKASHIMA KOUICHI
2 patentsUS8178893B2May 15, 2012
Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate
TAKASHIMA KOUICHI7 citations79
US8575625B2Nov 5, 2013
Semiconductor element mounting member, method of producing the same, and semiconductor device
TAKASHIMA KOUICHI0 citations42