Inventor

MORIGAMI HIDEAKI

JP8 patents

⚠️ This page may combine multiple inventors who share the name “MORIGAMI HIDEAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUMITOMO ELECTRIC INDUSTRIES

4 patents

US5425491AJun 20, 1995

Bonding tool, production and handling thereof

SUMITOMO ELECTRIC INDUSTRIES90 citations95

US7528413B2May 5, 2009

Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it

SUMITOMO ELECTRIC INDUSTRIES12 citations79

US5373731ADec 20, 1994

Bonding tool, production and handling thereof

SUMITOMO ELECTRIC INDUSTRIES11 citations72

US11668009B2Jun 6, 2023

Composite member

SUMITOMO ELECTRIC INDUSTRIES0 citations47

TAKASHIMA KOUICHI

1 patent

US8178893B2May 15, 2012

Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate

TAKASHIMA KOUICHI7 citations79

ALMT CORP

1 patent

US12112993B2Oct 8, 2024

Heat radiation member

ALMT CORP0 citations57

A L M T CORP

1 patent

US12595980B2Apr 7, 2026

Composite member

A L M T CORP0 citations39

MORIGAMI HIDEAKI

1 patent

US8664088B2Mar 4, 2014

Manufacturing a heat sink material using a discharge wire

MORIGAMI HIDEAKI0 citations33