Inventor

WANG CHIEN-HAO

TW36 patents

⚠️ This page may combine multiple inventors who share the name “WANG CHIEN-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG CHIEN-HAO

ADVANCED SEMICONDUCTOR ENG

Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof

Method of fabricating substrate with embedded component therein

Coreless thin substrate with embedded circuits in dielectric layers and method for manufacturing the same

Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same

Multi-chip build-up package of optoelectronic chip

Multi-chip package structure and method of fabricating the same

Manufacturing method for integrating passive component within substrate

Embedded component package structure and manufacturing method thereof

Embedded component package structure and manufacturing method thereof

Embedded component package structure and manufacturing method thereof

Embedded component package structure and manufacturing method thereof

Embedded component package structure and manufacturing method thereof

Embedded component package structure and manufacturing method thereof

Manufacturing process of a carrier

Embedded component package structure and manufacturing method thereof

Process for manufacturing substrate with bumps and substrate structure

Manufacturing process for embedded semiconductor device

Manufacturing process and structure for embedded semiconductor device

Substrate with multilayer plated through hole and method for forming the multilayer plated through hole

Embedded component package structure, embedded type panel substrate and manufacturing method thereof

WANG CHIEN-HAO

Circuit board process

Coreless substrate and method for making the same

Surface treatment process for circuit board

Manufacturing method of embedded circuit substrate

Method of fabricating multi-chip package structure

UNIV NAT TAIWAN

Fever epidemic detection system and method thereof

Vehicle information and environment monitoring compound vehicle system and data processing and transmission method therein

Sensing circuit, sensing device and monitoring system for power transmission lines

Grid gateway and transmission tower management system with multiple grid gateways

TEXAS INSTRUMENTS INC

Single wavelength reflection for leadframe brightness measurement

Semiconductor die with stepped side surface

Single wavelength reflection for leadframe brightness measurement

SU YUAN-CHANG

Embedded component substrate and manufacturing methods thereof

CHEN MIN-YAO

Method of fabricating a multi-trace via substrate

WANG CHIEN HAO

Method for manufacturing a circuit board

CHIPMOS TECHNOLOGIES INC

Method for manufacturing chip package structure