Inventor
LOY JERALD M
US8 patents
Patents
8 patentsUS5066614ANov 19, 1991
Method of manufacturing a leadframe having conductive elements preformed with solder bumps
HONEYWELL INC102 citations95
US4649339AMar 10, 1987
Integrated circuit interface
HONEYWELL INC149 citations95
US5161729ANov 10, 1992
Package to semiconductor chip active interconnect site method
HONEYWELL INC23 citations92
US5099306AMar 24, 1992
Stacked tab leadframe assembly
HONEYWELL INC47 citations91
US4933810AJun 12, 1990
Integrated circuit interconnector
HONEYWELL INC24 citations89
US4892245AJan 9, 1990
Controlled compression furnace bonding
HONEYWELL INC50 citations88
US5010387AApr 23, 1991
Solder bonding material
HONEYWELL INC15 citations73
US5126920AJun 30, 1992
Multiple integrated circuit interconnection arrangement
HONEYWELL INC19 citations69