Inventor

WANG KEN JIAN MING

US20 patents

⚠️ This page may combine multiple inventors who share the name “WANG KEN JIAN MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG KEN JIAN MING

SANDISK CORP

Printed circuit board with coextensive electrical connectors and contact pad areas

Substrate warpage control and continuous electrical enhancement

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Padless substrate for surface mounted components

Rounded contact fingers on substrate/PCB for crack prevention

Hidden plating traces

SANDISK TECHNOLOGIES INC

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Printed circuit board with coextensive electrical connectors and contact pad areas

TAKIAR HEM

Hidden plating traces

Hidden plating traces

Substrate panel with plating bar structured to allow minimum kerf width

BROADCOM CORP

Lead frame-BGA package with enhanced thermal performance and I/O counts

Integrated circuit package with etched leadframe for package-on-package interconnects

WANG KEN JIAN MING

Semiconductor die having increased usable area

Low cost lead frame package and method for forming same

LIAO CHIH-CHIN

Printed circuit board with coextensive electrical connectors and contact pad areas

Printed circuit board with coextensive electrical connectors and contact pad areas

KHAN REZAUR RAHMAN

Integrated circuit package with etched leadframe for package-on-package interconnects

CHIU CHIN-TIEN

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging