Inventor
CHAN CHIN-JONG
TW6 patents
⚠️ This page may combine multiple inventors who share the name “CHAN CHIN-JONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WINBOND ELECTRONICS CORP
5 patentsUS6181016B1Jan 30, 2001
Bond-pad with a single anchoring structure
WINBOND ELECTRONICS CORP63 citations95
US6551916B2Apr 22, 2003
Bond-pad with pad edge strengthening structure
WINBOND ELECTRONICS CORP31 citations92
US6313541B1Nov 6, 2001
Bone-pad with pad edge strengthening structure
WINBOND ELECTRONICS CORP44 citations92
US6002179ADec 14, 1999
Bonding pad structure for integrated circuit (I)
WINBOND ELECTRONICS CORP30 citations88
US5962919AOct 5, 1999
Bonding pad structure for integrated circuit (III)
WINBOND ELECTRONICS CORP28 citations86