Inventor

HUANG YVES

TW3 patents

⚠️ This page may combine multiple inventors who share the name “HUANG YVES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KINGPAK TECH INC

2 patents

US6642554B2Nov 4, 2003

Memory module structure

KINGPAK TECH INC2 citations54

US6751882B1Jun 22, 2004

Mechanism for positioning a substrate of an image sensor

KINGPAK TECH INC0 citations24

HSIN CHUNG HSIEN

1 patent

US8314481B2Nov 20, 2012

Substrate structure for an image sensor package and method for manufacturing the same

HSIN CHUNG HSIEN0 citations45