Inventor · disambiguated record
Hidehiko Okuda
Also filed as: OKUDA HIDEHIKO
9 granted patents·3 pending applications·96 citations·filing 2005–2010
87Inventor score
Files withSUMCO CORP12
Top patents by PatentIndex Score
12 records- 0195US7354844B2Method for manufacturing SOI substrateSUMCO CORP·Filed 2006·Granted Apr 8, 2008·43 cites·9 claims
- 0290US7763541B2Process for regenerating layer transferred waferSUMCO CORP·Filed 2006·Granted Jul 27, 2010·19 cites·15 claims
- 0386US7364984B2Method for manufacturing SOI substrateSUMCO CORP·Filed 2007·Granted Apr 29, 2008·12 cites·8 claims
- 0479US7416960B2Method for manufacturing SOI substrateSUMCO CORP·Filed 2007·Granted Aug 26, 2008·7 cites·7 claims
- 0578US7767549B2Method of manufacturing bonded waferSUMCO CORP·Filed 2007·Granted Aug 3, 2010·8 cites·7 claims
- 0675US7541663B2P-type silicon wafer and method for heat-treating the sameSUMCO CORP·Filed 2005·Granted Jun 2, 2009·4 cites·6 claims
- 0774US7311775B2Method for heat-treating silicon wafer and silicon waferSUMCO CORP·Filed 2005·Granted Dec 25, 2007·2 cites·4 claims
- 0862US7939441B2P-type silicon wafer and method for heat-treating the sameSUMCO CORP·Filed 2009·Granted May 10, 2011·1 cites·1 claims
- 0947US2009186464A1Method for producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1046US2010144131A1Method for producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1143US7745306B2Method for producing bonded waferSUMCO CORP·Filed 2007·Granted Jun 29, 2010·0 cites·2 claims
- 1236US2011065258A1Method of producing bonded substrateSUMCO CORP·Filed 2010·Application pending·0 cites
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